Sustainable innovations highlighted in Beijing’s new Capital International Exhibition and Convention Centre. Photo Credit: Zaha Hadid Architects/Virgile Simon Bertrand
Beijing’s newest and largest exhibition venue, the Capital International Exhibition and Convention Centre (CIECC), officially opened last week. Situated in Shunyi District, the venue is located just 2 km from Beijing Capital International Airport, with the goal of becoming an international exhibition hub.
Spanning 611,000 sqm, the CIECC is now Beijing’s largest exhibition venue, featuring an indoor exhibition space of 210,000 sqm and a conference area of 15,000 sqm. The facility includes nine expansive exhibition halls, each covering approximately 23,000 sqm, designed to accommodate large-scale trade shows, conventions, and business events. The centre also integrates a smart facility-guidance system, with electronic information displays and patrolling robots to assist visitors.
Designed by Zaha Hadid Architects, the centre boasts an array of eco-friendly features, aligning with modern demands for environmentally responsible construction and operations, setting a new benchmark for sustainability in large-scale event venues.
A central component of the CIECC's sustainability is its architecture. The design incorporates hybrid ventilation, which reduces the need for energy-intensive air conditioning, alongside high-efficiency HVAC systems that optimise energy use across the vast venue. The building also features smart management systems to monitor and reduce energy consumption.
Water conservation is another key priority for the centre. Rainwater collection and greywater recycling systems have been implemented to minimise water use.
Photovoltaic panels are another sustainable feature of the centre. These solar panels contribute to the centre’s energy generation, helping to power the building with renewable energy.
The combination of these eco-friendly features has allowed the CIECC to receive the highest certification under China’s Green Building Program.